The result of the determined production is verified by anaccelerated ageing (burn-in) and extensive testingprocedure performed on 100 % of the individual resistors.Only accepted products are stuck directly on the adhesivetapes in accordance with IEC 60286-1.
Document Number: 28726Revision: 21-Aug-07
ASSEMBLY
The resistors are suitable for processing on automaticinsertion equipment and cutting and bending machines.Excellent solderability is proven, even after extendedstorage. They are suitable for automatic soldering usingwave or dipping. The encapsulation is resistant to allcleaning solvents commonly used in the electronics industry,including alcohols, esters and aqueous solutions. Thesuitability of conformal coatings, if applied, shall be qualifiedby appropriate means to ensure the long-term stability of thewhole system.
APPROVALS
Where applicable, the resistors are tested in accordance withCECC40101-806 which refers to EN 60115-1 and EN 140100.
Vishay BYSCHLAG has achieved "Approval ofManufacturer" in accordance with EN 100114-1
87
UXA 0204, UXB 0207, UXE 0414
Vishay Beyschlag
FUNCTIONAL DESCRIPTION
High Precision Leaded Resistors
Derating - Precision Operation
Temperature Rise
88
Document Number: 28726
Revision: 21-Aug-07
UXA 0204, UXB 0207, UXE 0414
High Precision Leaded Resistors
Vishay Beyschlag
TESTS AND REQUIREMENTS
Essentially all tests are carried out in accordance with thefollowing specifications:
EN 140000/IEC 60115-1, Generic specification (includestests)
EN 140100/IEC 60115-2, Sectional specification (includesschedule for qualification approval)
CECC 40101-806, Detail specification (includes schedule forconformance inspection)
Most of the components are approved in accordance with theuropean CECC-system, where applicable. The TestProcedures and Requirements table contains only the mostimportant tests. For the full test schedule refer to thedocuments listed above. The testing also covers most of therequirements specified by EIA/IS-703 and JIS-C-5202.The tests are carried out in accordance with IEC 60 068 andunder standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (ratedtemperature range: Lower Category Temperature, UpperCategory Temperature; damp heat, long term, 56 days) isvalid.
Unless otherwise specified the following values apply:Temperature: 15 °C to 35 °CRelative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).For testing the components are mounted on a test board inaccordance with IEC60115-1, 4.31 unless otherwisespecified.
In the Test Procedures and Requirements table only thetests and requirements are listed with reference to therelevant clauses of IEC 60115-1 and IEC60068-2; a shortdescription of the test procedure is also given.
TEST PROCEDURES AND REQUIREMENTS
IEC 60115-1CLAUSE
IEC60068-2TESTMETHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
Stability for product types:
UXA 0204UXB 0207UXE 0414
4.5
-resistance (ΔR/R)temperature coefficient
at 20/LCT/20 °C and 20/UCT/20 °C
room temperature;
U70 or
Umax;1.5 h on; 0.5 h off70°C; 2000 h85°C; 1000 h85°C; 8000 h
± (0.05 %R +0.01Ω)± (0.02 %R +0.01Ω)± (0.04 %R +0.01Ω)
± (0.05 %R +0.01Ω)± (0.03 %R +0.01Ω)± (0.06 %R +0.01Ω)
± (0.05 %R+0.01Ω)±(0.04%R+0.01Ω)±(0.08%R+0.01Ω)
100 Ω to 100 kΩ100 Ω to 250 kΩ100 Ω to 100 kΩ
22Ω to < 100Ω;> 100 kΩ to 221 kΩ 40.2Ω to < 100 Ω;> 250kΩ to 301 kΩ22Ω to < 100 Ω;> 100kΩ to 511 kΩ
-10Ω to < 40.2 Ω;> 301 kΩ to 1 MΩ
-
± 0.25 %; ± 0.1 %; ± 0.05 %; ± 0.01 %
4.8.4.2-± 10 ppm/K; ± 05 ppm/K; ± 02 ppm/K
4.25.1-endurance
Document Number: 28726Revision: 21-Aug-07
89
UXA 0204, UXB 0207, UXE 0414
Vishay Beyschlag
High Precision Leaded Resistors
TEST PROCEDURES AND REQUIREMENTS
IEC 60115-1CLAUSE
IEC60068-2TESTMETHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE (ΔR)
Stability for product
types:
UXA 0204UXB 0207UXE 0414
endurance at
upper category temperaturedamp heat,steady stateclimatic sequence:
2 (Ba)
dry heatdamp heat, cyclic
coldlow air pressuredamp heat, cyclic
125°C; 16h 55°C; 24h;90% to100%RH;
1 cycle
- 55 °C; 2h8.5kPa;2h;15 °Cto35°C55°C; 5days;95% to100%RH;
5 cyclesroom temperature;U= 2.5 x 70 orU = 2xmax; 5 s30minutes at LCT and30minutes at UCT;
5cyclesisopropyl alcohol + 23 °C; toothbrush
methodunmounted components; (260± 5)°C; (10± 1)s+ 235°C; 2 s solder
bath method
± (0.04 %R +0.01 Ω)no visible damage
