Printed Circuit Board Fabrication Seminar
印制板制造技术研讨
1．Basic PCB Construction & Terminology 基础PCB制造术语和名词 2．Quotations 引文
3．Front End Engineering 前后工程处理 i) ii) iii) iv)
PAR (Produceability Analysis Review) PAR可制作性评审 Product Engineering 工程制作
CAM(Computer Aided Manufacturing) 计算机辅助制造 Photoplotting 光绘
4．Manufacturing Process 制作过程 i) ii) iii) iv) v) vi) vii) viii)
lnner Layer 内层 Multilayer 层压 NC Drilling数控钻床 Electroless Copper 化学沉铜 Outer Layer lmaging外光成像 Wet Processes湿法流程 Soldermask阻焊
Solderable Finishes(HASL & Alternatives)表面涂覆（热风整平或其他可以选择
的方法） ix) x) xi) xii)
Tab Gold Plating镀金手指 Idents字符
NC Routing数控铣外形
QC Inspection QC检查
5．Frequently Asked Questions常见问题 i) ii) iii) iv)
Solderability可焊性 Ionic Cleanliness离子污染度 Controlled impedance阻抗控制 Blind & Buried Vias盲埋孔
6．PCB Specifications PCB规范
7．Future Technologies PCB未来发展技术 i)Microvia
第一部分 Basic PCB Construction & Terminology 基本PCB构造和技术
Basic Multilayer Foil Build多层板叠合结构
Copper Foil铜箔
Prepreg半固化片
Core芯片 Prepreg半固化片
Core芯片 Prepreg半固化片
Example：Foil Build - 6 layer board
样板：6层板结构
Basic PCB Construction Materials制造原料
Laminates (cores,C-Stage) 铜箔（芯板、C－阶段） ·fully cured fiberglass-resin system完全胶连的玻璃树脂系统 ·copper clad铜箔
·identified by core thickness,copper weight鉴别芯片厚度、铜箔重量 “Prepregs”(B-stage) 半固化片（B阶段）
·Pre-impregnated Bonding Layers提前注入连接层
·Partially cured fiberglass-resin system部分胶连的玻璃布树脂系统 ·identified by glass type根据玻璃布类型鉴别 Copper Foils铜箔
·Electrodeposited(ED)Std & DSTE电解铜或压延铜过程 ·1Oz = 0.0014” Key Factors关键因素 ·Grain Direction晶粒方向 ·Scaling Factors缩放比例因素 ·Single Source Vendors
Sample Laminates Laminate Nominal Tolerance 公差 ＋/－0.0007 ＋/－0.0010 ＋/－0.0010 ＋/－0.0015 ＋/－0.0015 ＋/－0.0015 ＋/－0.0025 ＋/－0.0025 ＋/－0.0050 Construction 结构 1080 106/2313 1080/2313 2313/2116 2*2116 1080/7628/1080 3*7628 4*7628 7*7628 Dk 介电常数 4.28 4.40 4.50 4.43 4.43 4.55 4.75 4.75 4.80 覆铜板样板 实际尺寸 0.0025 0.0050 0.0050 0.0080 0.0095 0.0120 0.0210 0.0280 0.0470
Part Numbering编号含义
0.0025 0.0055 0.0062 0.0085 0.0097 0.0124 0.0215 0.0287 0.0470 Natural color自然颜色 pits &dents class凸点级别 Flame retardant阻燃剂 thickenss tolerance class厚度公差级别
Glass reinforcement玻璃布加强 warp &twist class弯曲和扭曲级别
GFN－0620－C1/C1－B2X Thickness of laminate 板料厚度
copper foil type(top/bottom)铜箔类型（顶层） copper foil thickness (top/bottom)铜箔厚度（顶层）
Sample prepregs半固化片样品 Glass Style 类型 106 1080 2116 7628 2113/2313
Pressed Thickness 厚度 0.0020 0.0025 0.0045 0.0070 0.0035 Resin Content 树脂含量 74% 65% 55% 43% 57% DK 介电常数 4.00 4.28 4.48 4.70 4.40 Alternative Resin Systems-Properties不同类型树脂系统及特性 Resin System 树脂系统 N4000-2 Multifunctional Epoxy(FR4) 多功能环氧树脂 N4000-6 Multifunctional Epoxy(FR4) 多功能环氧树脂 N4000-6T Thenmovnt Epoxy 热敏环氧树脂 N4000-13 Multifunctional Epoxy(FR4) 多功能环氧树脂 N5000 Bismale mide Tria Zine(BT) 180 Epoxy N7000-1 N7000-2 N8000 Polyimide Toughened Polyimide Cyanate Ester 250 220 250 4.3 4.3 3.8 12-15 9-13 11-13 4.1 10-14 25 - 35 140 - 160 200 3.9 10-14 180 3.9 8-12 25 – 35 160 – 170 180 4.4 10-14 25 – 35 160 – 170 Better,thema,electrical,cherrical pmparticsl r 更好的热、电、化学的性质 Lowest x/y CTE. Taser abletable, Tg(degC) 玻璃转化温度 140 Dk 介电常数 4.4 12-16 X/y CTE Z CTE Z CTE Comments 备注 Most common最普通 (-40 - 125C) (50 – 200C) 30 - 40 170 - 190
Alternative Resin Systems – Fabrication Parameters不同类型的树脂系统及生产参数
Resin System 树脂系统 N4000-2 Multifunctional Epoxy(00.FR4) 多功能环氧树脂 B4000-6 Multifunctional Epoxy(FR4) 多功能环氧树脂 N4000-6T Thenmovnt Epoxy 热敏环氧树脂 N4000-13 Multifunctional Epoxy(FR4) 多功能环氧树脂 N5000 Bismale mide Tria Zine(BT) 1 - 2K Epoxy N7000-1 N7000-2 N8000 Polyimide Toughened Polyimide Cyanate Ester 0.75 – 1.5K 0.75 – 1.5K 0.75 – 1.5K 1 1 - 2 1 Plasma Plasma Plasma 300min 240min 300min 1 - 2 Plasma 180min 1 – 1.5K 1 - 2 Permanganate 120min 2 - 4K 2 - 4 Permanganate 90min 1 - 2K 2 - 3 Permanganate 90min Drill Hits 钻孔数量 2 - 3K Drill Stack 叠数 3 - 4 Desmear 除胶 Permanganate Press Cycle 压板周期 45min
第二部分 Quotations报价
Information Required to Quote要求客户提供信息
·Gerber File Data光绘文件
·Aperture File(except with 274*format)光圈文件 ·Drill File钻孔文件
·Specifications(IPC standards,specifications,notes)标准（IPC标准、说明和注意事项等）
·Mechanical Drawing(dimensions)机械加工图纸
Electronic Data Transfer数据传输方式
·MODEM ·E-mail,FTP
·Scaned Film扫描底片
·Optimiz ation of panelization done at quoting stage 报价阶段将板规格最优化
·Standard manufacturing panels ：14*24；18*24（preferred）；21*24 标准拼板尺寸：14*24；18*24；21*24
·Usable space：0.600” border for double sided；0.750”border for multiplayer 可使用范围:双面板，0.6英寸；多层板：0.75英寸 ·Clearance:0.150”between boards for pinned routing 净空：板与板间预留0.15英寸外形定位空间 ·Yield: <60% Poor；>75% excellent yield 利用率：小于60%不好；大于75%利用率非常佳 ·We cost by manufacturing panel,not board! 我们的报价是根据生产拼板，而不是交货板
·Standard 0.5”*6”coupons added to all multiplayer board 标准的0.5*6英寸付联板增加到所有的多层板上 ·Multiple orientations are permissible 多层次的定位是允许的
·Tab gold fingers require busing, can limit orientation 金手指可控制朝向
·Registration requirements can limit panel size
·Some special restrictions: customer data size(Mb)；immersion gold tank size；etc.
一些特殊限制：客户数据大小；沉金槽尺寸；其他 ·Small boards preferred in array format 小板需要通过排布格式优化
Printed Circuit Board Cost Driver Hierarchy 对PCB成本影响的趋势
Layer Count 层数
Physical Size(Panelization) 尺寸大小 Surface Finishes 表面涂覆类型 Board Thickness 板厚 Surface Density 表面路线密度 Specifications 规范特殊要求 Drilling钻孔
Depanelization板边大小
lesser Impact
影响小Greater Impact
影响大
and of course, Quantity and Delivery!!! 当然，数量和交货期也是非常重要的因素。
第三部分 Front End Engineering工程设计
i)
PAR (Produceability Analysis Report) 可制作性评审报告
·Receives customers board design data in a “Gerber” electronic format(i.e. board dimensions, hole sizes and count, layer order, special requirements) 收到客户设计线路板光绘文件（包括板的参数、孔径大小和数量、层命令、特殊要求）
·Identification and Registration of layers 鉴别和定义层
·Runs Design Rule Inspection to identify concems which may impact manufacturability of board.
应用DRC检查确定涉及到制作能力的参数
Sample Manufacturing Restrictions 生产能力限制
Minimum PTH Diameter 最小金属化孔孔径：0.010” Minimum CU-CU Spacing 最小铜与铜间距：0.005” Minimum Trace Width 最小线宽：0.005” Minimum Annular Ring 最小环宽：0.0075 Minimum Solder Mask Dam 最小阻焊桥：0.004”
·Identify manufacturability enhancements to be made (i.e. teardropping, plane clipping)
通过加辅助性设计提高可制作性（如泪滴、板编辑等）
·Forward Gerber data to sub contractor for generation of netlist and electrical test fixture
对照光绘文件数据产生网络和电测夹具 ii)
Product Engineering 工程制作
·Customer specification review 客户资料检查
·Determination of stack-up for lamination 确定层压结构
·Determination of the Manufacturing Process(Job Planning) 确定制作流程 ·Release Job to the floor with corresponding Flow Sheet 通过流程单释放指示
·Controlled impedance calculations 阻抗控制计算 iii)
CAM（Computer Aided Manufacturing） CAM计算机辅助制造
·“Perfect” digital artwork panelization and alignment优化底片尺寸和定位 ·1-UP edits, in-house customer correction and improvements with respect to manufacturing tolerances.(i.e.teardropping)
根据客户要求修正文件，通过添加辅助设计降低生产制造难（如泪滴） ·Addition of date code, UL vendor code. 增加制造日期，公司UL标记等 ·Uses Gerber files generated at PAR应用光绘文件完成可制作性分析评审报告 ·Step and Repeat for panelization(per quotation) 分步和再现拼板 ·Addition of test coupons to panels 添加测试付联条 Creates the following programs 制作以下流程：
Artwork plotting 光绘程序 Drilling program 钻孔程序
AOI(Automatic Optical Inspection) AOI文件 Routing program 外形程序 Scoring program iv)
Photoplotting 激光光绘
·The artwork or phototool is plotted from the panelized Gerber data created in CAM
光绘机从处理好的光绘文件绘制底片
·Laser Photoplotter-0.00025”resolution 激光光绘机光绘极限0.00025英寸 ·Silver halide emulsion (silver shot) 银盐片制作 ·Diazo copies for some processes 重氮复片
·Positive and negative artworks depending on usage 根据不同的胜任决定底片的正负性
·Artwork is punched with tooling holes with camera-target system 通过摄像标靶系统定位冲出底片上的工具孔 ·Visual inspection for detects 目测检验开路
·Clean Room conditions(class 10,000)with controlled Temperature(20℃)and Relative Humidity(50%)
菲林洁净房的洁净度（10000级），温度（20℃）和相对湿度（50%） ·Artwork must be generated and used in same environment 工作底片在制作和使用应在同亲环境 ·Vertical film storage 重直保存底片
·Surface area calculations for plating 电镀面积计算
第四部分Manufacturing Process 生产流程
Printed Circuit Board Process Flowchart 流程图
Soldermask/HASL Routing Quality Control Packing &shiping
Inner layer Outer Layer Electroless Drilling Front End Engineering (PAR, Product Engineering CAM. Photoplotting) Inner Layer Multi Layer i) inneriayer 内层
1. Chemical Cleaning: Removes the anti-tarnish coating, dirt, grease, from the copper ciad laminate.
化学清洗：去除铜箔面上的氧化层、不光泽物、污物和油脂。
2. Dry Film Lamination: Application of an UV sensitive film to the cleaned surface of the copper laminate through controlled heat and pressure. The line includes material surface preparation, CSL, loader and Stacker.
在清洁的覆铜板两面贴上一层UV光敏材料―――干膜、贴膜通常在全自动贴膜机上完成，在加热加压的条件下将干膜粘贴在覆铜板面上。干膜中的抗蚀剂层受热后变软，流动性增加，借助于热压辊的压力和抗蚀剂粘结剂的作用完成贴膜。
3. Dry Film Exposure: A negative phototool or artwork is imaged into the dry film, on both sides of the copper clad, through UV light exposure leaving a positive image in the dry film.
During exposure the UV energy is absorbed by the dry film directly underneath the clear areas of the overlaying artwork, causing it to polymerize and harden. The film covered by dark areas of the artwork remains soft.
曝光：将负片底片覆盖在覆铜板两面，经过紫外光照射曝光后在干膜上产生正片图像。
曝光过程是在紫外光照射下，未被底片挡住部分的干膜中的光引发剂吸收光能分解成洲离基，游离基再引发聚合单体进行交联反应，反应后生成不溶于稀碱溶液的体形大分子结构人。
4. Dry Film Developing: After the dry film is imaged, the unexposed soft areas of the film are dissolved away while the hardened dry film remains unaffected. 显影：干膜中未曝光部分的活性基因与稀碱溶液反应生成可溶性物质而溶解下来，曝光部分的干膜不被溶解。
5. Copper Etch: The remaining hardened dry film on the copper acts as a “Resist” and the unprotected copper is chemically dissolved or etched.
蚀刻：保护性的干膜再覆铜板上形成图像，那些显影掉，未被干膜保护的不需要的铜膜，在化学蚀刻工序中被蚀刻掉。
6. Strip Resist: The hardened dry film is stripped from the copper leaving the desired copper pattern reproduced from the artwork. The lnner-layer image transfer process has been completed.
去膜：蚀刻后将抗蚀层干膜去除，得到所需的裸铜电路图图。内层图形转移过程就这样完成了。
7. Post-Etch-Punch(PEP): This process punches tooling holes which are used to align inner-layer cores in subsequent processes.
冲孔：冲孔机冲的孔用于下工序内层定位。冲孔机利用带靶形的摄像系统在铜板上定位，冲出的孔有非常高的精确度。
8. Automated Optical Inspection (AOI)： lnner-layer cores are inspected with the use of a comouter aided optical inspection system to locate any pattern defect that may have occurred during the image transfer process.
The AOI process uses a datafile generated at CAM, the machine compares the image scaned versus a graphic computer file. AOI benefits consist of early detection of process deviations, reduction of finat test fallout’s, consistent line width and tolerances. Repairs can be made here to weld innerlayer opens or trim innerlayer shorts per customer specifications.
自动光学检测（AOI）：AOI机主要利用电脑辅助光学系统检测内层光成像中产生的缺陷。
AOI用计算机制作数据测试文件，将扫描的图形与计算机图解文件时行对照，AOI的优点在于尽早检测出内层产生的偏差、线宽公差、减少最终检验报废，检测出的内层/短路可进行返修。
Critical Factors for Fine Line Resolution 细线路生产影响因素 ·Tightly controlled clean room temperature and relative humidity 严格控制室内的温度与相对湿度
·Room and equipment cleanliness 保持室内与设备清洁无尘 ·Collimated light sources 曝光机紫外光光源平行 ·Total UV exposure 曝光充分
·Intimate phototool and dry film contact 底片与干膜紧密结合
·Adequate exposing energy/time 适当的曝光能量/时间
·Good dry film adhesion to copper foil 良好的干膜与铜面粘接 ·Tight chemistry controls on develop/etch/strip lines 显影/蚀刻工序中严格的化学控制
·Good fluid spray patterns 好的喷淋显影点控制 ·Reduced copper foil thickness 减少铜箔厚度
Coretec production capability is presently 5 mil line/5 mil space(+/- 1 mil), commonly in 1/2 to 1 oz copper.
目前一般的生产能力：铜箔厚度0.5或10OZ；5mil线宽，5mil线距（＋/-mil）
9. Inner-layer Oxide: This process is designed to intentionally create a coating of copper oxide onto the copper circuitry to enhance the surface topography. This will increase the bond strength between the core and the bonding materials used in the multi-layer laminateon. 内层黑化：为提高铜表面与预浸材料之间在层压后的结合力所采用的氧化处理工艺。对铜表面进行化学氧化（黑化），使其表面生成一层氧化物（黑色的氧化铜或棕色的氧化亚铜或两者的混合物），以进一步增加比表面，提高粘结力。
ii) Multilayer 层压
Vacuum Press Lamination: Lamination is the process of bonding cores together to form a multi-layer panel. Lnner-layer oxidized cores are stacked up with prepreg and copper foils, depending on the type of build. Multi-layers are laminated using a Hydraulic Press.
Coretec utilizes a Vacuum Assisted Hydraulic Press which improves resin flow and increases moisture/volatiles removal. The press utilizes an automatic cure cycle control which supplies heat/pressure/vacuum. The presses are coupled with a controlled cooling cycle under pressure to reduce warpage. 层压是借助于B－阶粘结片把各层线路薄板（内层、半固化片、铜箔）粘结成一整体的一个生产过程。层压机可以分为非真空液压和真空压机。
真空层压易于树脂流动量，不易出现白班或裂纹。真空压机通过制动加热循环控制系统，提供热量/压力/真空度，压机通过冷却控制系统在一定压力下进行板冷却，
减小翘曲发生。
iii) NC Drilling 数控钻孔
Panels arriving from the vacuum press will be drilled to create interconnections between the different layers of the circuitry.
The drills are CNC controlled and receive files from CAM which contain the number of hits, hole sizes, and the path for the drill head to follow. 层压后到钻孔工序进行孔加工，使各层线路间形成网络连接。 数控钻机从CAM中接受数据文件，包括钻孔数、孔大小及钻孔路径。
·Panels from the lamination presses are first routed and edge beveled to clean up the edges of the panels. The tooling holes are spot faced to allow the panels to lie flat on the drill table.
层压后先裁连，以使板连平整。铣出定位孔处的铜箔，用冲孔机冲出定位孔。 Panels are drilled typically in stacks of 3 high + entry foil & backup material.
一般是钻3个定位孔。
·Larger drills may process 4-5 panel stacks simultaneously. 大孔可以4-5叠板同时钻。
·Tool management system provides storage for up to 120 drills per spindle, automatic tool change when maximum hits reached.
钻刀库可以存放120把刀每个钻轴，在钻孔时可以自动的更换钻刀。
·Drill ROM and plunge speed are automatically adjusted for each drill size. 钻速与进给速度根据钻刀大小来调节。
·Typical panels have 10000-12000 holes (some as much as 30K).Takes approx. 1 hour to process.
一般的板要钻10000-12000个孔（最多可达到3万），大约需钻一个小时。 ·Panels are checked with X-Rays for hole Registration in inner-layers. Introduction of scale factor may be necessary to center drill pattern to copper pattern.
X-Ray机可以测量内层上的孔位置精度，通过涨缩系数的调整是必要的，可以使钻孔与导体图形对正。
·Smallest drill hole capability is 13.5 mil diameter with a drill aspect ratio of 6:1.
最小能钻直径直径为13.5mil的孔，最小板厚孔径为6：1。
Deburring As drill removes copper a small copper ridge forms around the hole edge. The burr is mechanically removed using scrubbing brushes and high pressure water blast to remove any debris from the holes.
去毛刺－钻孔后会在铜箔和孔壁上产生粗糙边。用机械方法（通常是用旋转的、含磨料的尼龙刷辊及高压水流水洗）去除毛刺。
iv) Electroless Crpper 沉铜
Desmear: Friction during drilling causes the drill to heat-up and melt the resin between copper layers. As the drill is removed. The soft resin will smear across internal conductors. The smeared resin will prevent electrical connect on to innerlayers, it must be removed by chemical or plasma attack. Coretec utilizes a chemical permanganate desmear process.
Etchback: Some specifications require electrical connection to three surfaces on internal conductors, hence in addition to desmear, additional resin and glass fibre must be relieved from the hole wall to allow access to three side of internal conductors. This is know as “positive etchback”. Usually a military-only requirement.
除胶：钻孔时的磨擦使钻刀升温，使得孔内板材中的树脂熔化。随着钻刀的移动，熔化的树脂会粘污到内层的导线上。因其妨碍内层连接的可靠性，所以必须用化学（高锰酸钾）或等电子方法清除。
凹蚀：某些标准要求内层铜的三面都同电镀铜层连接，因此通过除胶过程可以将树脂和玻璃纤维从孔壁上咬蚀掉一部分，使镀层与内层达到三面联接的效果，这常常叫做“正凹蚀”，通常军标也提出类似要求。
Electroless Copper is a chemical metalization process intended to metallize the surface of dielectric material at the hole wall and institute electrical connection between all exposed copper surfaces. The process deposits a very thin(75 micro-inches), fragile coating of pure copper over the entire surface of the panel, this includes the drilled hole walls and the external surfaces.
化学沉铜：为了使孔壁上不导电的树脂及玻璃能够导电，进行化学沉铜，使孔壁与板面上沉上的一层很薄的铜层，只有大约75微英寸厚（0.5mil），再通过全板电镀，使板面和内层铜联接起来。
v) External Imaging 外光成像
Dry Film Lamination: Just as in inner layer, photosensitive dry-film is laminated on both sides of the panel.
贴干膜：与内层相同，将干光性干膜帖覆在两边板面上。
Dry Film Exposure: A positive image is used to create a negative(reverse) image of the external circuitry onto the dry-film, note that the dark areas of the artwork cover the panel holes. The film and the artwork are exposed to UV light and the external image is created.
曝光：用正像的菲林产生负像的线路图形，菲林上黑色图形区域将板面上的孔覆盖，菲林与干膜经紫外光曝光后产生图形。
Dry-Film Developing: The unexposed areas of the dry-film are dissolved away. The dry-film creates a “channel”for copper pattern plating to take place. 显影：干膜上未被曝光的部分被显影药水溶解，于是在干膜面上出现沟槽，经过图形电镀将形成“图形”。
vi) Wet Processes 湿流程
Copper Plating: Copper is electrodeposited onto the copper foil that is outlined by the dry film. Copper is plated on the surface and in the holes of the panel. The panels are suspended in an acid-copper bath along with copper anode balls. Current from a DC rectifier drives copper to be consumed from the anodes and deposited on the plated surfaces. Organic compounds are also introduced to the plating baths to control deposition rates. Tin plating: Immediately after copper plating, a thin layer(0003”) of tin is electroplated on the surface of the copper. Tin will act as an etch resist in a future manufacturing process.
镀铜：图形转移完成后将进行图形电镀。在表面线路与孔壁都镀上一层铜。简单的介绍电镀过程：将板侵入装有铜阳级的酸性溶液中，在直流电流作用下，铜离子离开铜阳极表面，沉积到板面线路与孔壁上，镀铜缸内加入了添加剂以控制铜离子
的沉积速率。
镀锡：镀铜后在铜表面再镀上一层锡，大约3mil厚，在下工序中起到抗蚀保护线路的作用。
Dry Film Strip: Removes the plating resist exposing the base copper underneath. The plated copper remains, protected by the tin plating etch resist.
去膜：蚀刻后露出的铜箔被蚀去，留下镀上锡保护的线路部分。]
Copper Etch: The exposed copper is removed through an etching process, while the plated tin acts as a resist-protecting the plated copper from the etchant.
去锡：除去镀锡层，显现出线路部分的铜线。（铜线由三层构成：基铜层、沉铜层
和电镀铜层）
vii) Soldermask 阻焊
Solder mask on Bare Copper(SMOBC): Solder mask is an insulative protective coating that is applied to the external circuitry after the SES process. Soldermask serves two purposes:
to electrically isolate copper features on the surface of the board. to protect the coated copper from mechanical and environmental damage. Coretec uses only liquid photoimageable soldermask(LPISM)for best resoluteion and ease of processing. Other processes(dry film, silkscreen)less common. Semi-gloss is standard, matte finishes also available.
PISM must be used in conjunction with “button print” operation to plug via holes.
裸铜覆阻焊膜工艺（SMOBC）：是一种保护层，涂覆在板不需焊接的线路和基材上，目的是防止焊接时线路间产生桥接，同时保护线路图形在机械和化学环境安全。 使用液态光成像阻焊效果好，也容易处理，其他的保护层如干膜和热固油墨等使用较少，另外哑光油墨（不光泽、不光滑的）也有一部分使用。 塞孔技术使用“点图”将导通孔塞住。
Photoimageable Soldermask Application: 工艺要点
1．Surface Cleaning: Removes oxide and contaminants by AlO2 scrubbing the panel.
表面清洁处理：去除板面氧化膜、污物，通常使用氧化铝粉磨板机处理。 2．Screen Print: Solder mask coating will cover completely the panel holes, pads and traces, on both sides.
网印：在板两面完全涂覆阻焊油墨，包括导通孔、焊盘。
3．Tack Dry: evaporate the mask solvents and cure the mask sufficiently to be handled in exposure step.
预烘：预烘的目的是使阻焊层进行热固化，有利与曝光一步的处理。
4．Exposure: PISM acts similarly to a Dry-Film, a negative artwork is used to create the image of the solderable are as like SMT pads, PTH. The solder mask is exposed to UV light in a controlled environment such as in inner or outer-layer.
曝光：使用负性菲林图形，将焊盘、SMT和孔位挡住，未挡住的油墨受紫外光照射后，发生光固化。
5．Develop: The unexposed PISM is developed away, leaving the solderable pads exposed.
显影：未曝光的部分阻焊膜显影时除去，已曝光部分留存。
6．Thermal Cure: The panels go through a controlled cure cycle(300 deg F)to haren the soldermask and make it a permanent board finish.
固化：固化的目的是使阻焊膜完全硬化交联，在140－150℃烘箱中40-60分钟即完成。
Printed Circuit Board ENGLISH
Training
（PCB专业英语培训）
本培训针旨在介绍PCB基本的专业英语，并对PCB专业英语分以下几个部分： 1． PCB 分类 2． PCB 材料 3． PCB 生产流程 4． 水处理 5． PCB 检验 6． 主要设备 7． 工程设计 8． 元器件组装
1．PCB Sort (PCB 分类):
Single sided board(单面板) Double sided Board(双面板) Multilayer Board(多层板)
Rigid board(刚性板) flexible board(挠性板) flex-rigid board(刚挠结合板) metal base PCB(金属基板)
Blind board(盲孔板) buried board(埋孔板) bare board (裸板)
Quick turn prototype(样板)
2．PCB Material(PCB 材料):
Copper clad laminate(CCL)(覆铜板) PREPREG(半固化片) Epoxy resin(环氧树脂) Copper foil(铜箔)
PTFE (Polytetralluoetylene) Teflon(聚四氟乙烯) dielectric constant（介电常数） Flexible copper clad(挠性覆铜板) silver film(银盐片) diazo film(重氮片)
Solder mask(阻焊) Dry film（干膜） legend ink(字符油墨) peelable solder mask(可剥离阻焊) flux(助焊剂) additive（添加剂）
3．PCB Process(PCB 生产流程) :
Wet process(湿法流程) Dry process(干法流程)
FOR MULTILAYER MANUFACTURE PROCESS（多层线路板生产流程）：
Laminate cut(覆铜板) scrubbing(擦板) Image transfer(图形转移) internal layer（内层） Exposure(曝光) Developing（显影） ETCHING(蚀刻) black / brown oxygen（黑/棕化） lay up(叠层) Laminating(层压) Drilling(钻孔) scrubbing(擦板) Plated through hole(孔金属化) PTH panel plating(板面电镀) pattern plating (plated resist) (图形电镀) Etching（蚀刻）Inspection（检验） Printing solder mask（阻焊印刷） Exposure(曝光) Developing（显影） Hot Cured（热固化） Hot Air Leveling（热风整平） IMMERSION GOLD（沉金） Printing legend ink (silkscreen printing)（字符印刷）Hot Cured（热固化） Routing
（铣外形）punch（冲孔） Bare board testing（裸板测试） Final Inspection（终检） Packing（包装） Delivery（发货）
4．Water treatment（水处理）
DI (dialysis ion) water（去离子水） Waste water treatment（污水处理） humidity （湿度）temperature（温度）
5．PCB Inspection（PCB 检验）：
Inspection standard(检验标准) defect open（开路） short（短路） measling（白斑） fibre exposure（漏基材） hole breakout（破孔） flatness（平面度） peel strength（剥离强度） thermal shock（热冲击） thermal stress（热应力） Reworking（返工） manufacture panel（制造拼板） light integrator（光积分仪） step scale（光尺） undercut factor（侧蚀系数） micro etching（微蚀） over etching（过蚀） swimming（滑移）
6．Major equipments（主要设备）:
Laser plotter(激光光绘机) CNC drilling machine（数控钻床） CNC routing machine（数控铣床） Scrubber（擦板机） Auto through hole plating line（自动沉铜线） panel plating line(板面电镀线) pattern plating line (plated resist) (图形电镀线) dry film laminator（贴膜机） Exposure（曝光机） developing line（显影线） Etching line（蚀刻线） Auto registration punch（冲孔机） Multilayer press system（多层板层压系统） Black oxidation line（黑化线） Automatic optical instrument AOI（自动光学检测仪） Flying Probe test FPT（飞针检测仪） Hot air leveling（热风整平机） Impedance control test system（阻抗控制检测仪）
7．Engineering Design（工程设计）:
lay out（布线） CAD (computer aided design) （计算机辅助设计） CAM (computer aided manufacture) （计算机辅助制造） EDA (Electronic design automatic) （电子设计自动化） origin（原点） mirroring（镜相） scaling factor（比例系数） network（网络） conductor track（导线） PAD（焊盘） width（宽度） gap spacing（间隙） aperture（光圈） round（圆形） oblong（长圆形） square（正方形） rectangle（长方形） tear pad（泪滴焊盘） isolation pad（隔离焊盘） thermal pad（热焊盘）
mounting hole（安装孔） via（过孔） Plating through hole PTH（金属化孔） NPTH（非金属化孔） tooling hole（定位孔） Fiducial (基准点、反光点) layer to layer spacing（层间距） layer Building up drawing（层叠图） external layer（外层） internal layer（内层） power layer（电源层） ground layer（接地层） signal line（信号线） target（标靶） slot（槽孔） tab connector (golden finger) （金手指） Impedance control PCB（阻抗控制） Golden board（黄金板） MI (manufacture information) （制造说明） NOPE ( no process engineering ) （重订单） photo plotting（laser plotting）（激光光绘） positive（正片） negative（负片）
8．Component Assembly（元器件组装）:
SMT (Surface mount technology) （表面贴装技术）
Bonding（邦定） DIP(dual inline package) （双列直插封装） QFP(quad flat package) （四面扁平封装） BGA(ball grid array ) （球栅封装）
SMD (Surface mount devices) （表面贴装设备） Placement machine（贴装机） REFOLW SOLDERING（回流焊） WAVE SOLDERING（波峰焊）
